Created on：2023-10-18 08:27

Advantages of semiconductor ceramic packaging

As the scale of integrated circuit design to increase, the design of the package is becoming more and more complicated. The general package can’t meet the electrical, mechanical and reliability requirements, and the demand of package customization has become more and more obvious. The frequently-used package materials are resin and ceramic, ceramic package has been more and more widely used, because its advantages of good air tightness, multi-layer wiring, high insulation impedance, thermal expansion coefficient and close to chip.

 

There are many types of ceramic package, and the common types in the market including CDIP, CPGA, CSOP, CLCC, CQFP, CBGA/CLGA and so on.

 

 

The advantages of ceramic package as follows:

 

1.Excellent physical properties：

Ceramics have excellent physical properties, such as high strength, excellent heat resistance, corrosion resistance, insulation and thermal conductivity. These physical properties make the packaged product more durable and stable.

 

2.Excellent electrical performance：

Ceramics can have superior electrical properties, such as high dielectric constant, low dielectric loss, high electrical insulation strength, etc. These excellent electrical properties help to improve the signal transmission quality and performance indicators of the product.

 

3.Good thermal management：

Ceramics have excellent thermal conductivity and thermal diffusion properties, which can effectively transfer heat from the heating device on the chip to the external environment. This helps maintain the stability and performance of the chip and prevents the chip from overheating under high loads.

 

4.Higher reliability：

Ceramic casings provide increased reliability and better resistance to vibration and shock. This helps to ensure that the packaged product remains stable and reliable even under difficult operating conditions.

 

In conclusion, the semiconductor ceramic packaging can greatly improve the stability, reliability, performance and life of the product, and increase the market competitiveness of the product.

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