High thermal conductivity Aluminum Nitride (AlN) ceramic substrate

Aluminum nitride (AlN) ceramic is the best available thermally conductive material (>170W/m*K) that is also a strong electric insulator. Furthermore, it has a low coefficient of thermal expansions (CTE) closing to semiconductor silicon. These characteristics make AlN ceramic substrate typically to be used for packages and sub-mounts of power components like power LEDs, high powers IC, high voltage inductors, etc. More and more it is also used for ceramic printed circuit boards in high power modules, such as IGBT, electronics drive trains, power management modules, specialty lighting…

Suntech’s standard AlN substrates are in thickness 0.385mm, 0.5mm, 0.635mm, 0.8mm and 1.0mm, customized specifications are also available. We are also good at laser scribing, surface grinding, polishing and other machining work.

Product Features

（1）High thermal conductivity (>170W/m*K), up to 5 times than that of alumina ceramics;

（2）Lower thermal expansion coefficient and similar to silicon chip. This helps to achieve high reliability of Si chip and thermal heat cycling;

（3）Smaller dielectric constant;

（4）Higher electric insulation;

（5）Excellent mechanical properties, flexural strength higher than alumina ceramics;

（6）Heat-resistant, superior corrosion resistance against molten metal;

（7）Very high purity, no toxicity.

Applications

Heat dissipation substrate, LED package, Power module, Wafer bonding, Power resistor.

Characteristic Values

General Dimension