Ceramics Capillary for Alloy wire Bonding

Background

As an important basic material for electronic packaging, the function of bonding wire is to realize the electrical connection between the semiconductor chip and the pin, and play the role of importing and exporting current and signal between the chip and the outside world. The miniaturization, large-scale and highly integrated development of electronic products require bonding wires with excellent electrical conductivity, thermal conductivity, oxidation resistance and plasticity. Compared with traditional bonding alloy wires, silver bonding wires have low price, excellent mechanical properties and electrical properties, and can be used in various high-end ultra-fine pitch devices. At the same time, the silver bonding process does not require protective gas. Therefore, silver wire, silver alloy wire and plated silver-based alloy wire replace gold wire in LED and some IC packaging applications.

However, compared with gold wire, alloy wire has higher hardness, and has higher requirements on the surface gripping ability of the capillary. The lack of push-pull force of the first welding and the second welding is the most common service life problem, which greatly reduces the production efficiency.

In order to achieve more efficient and reliable bonding with silver alloy wire, the specially treated texture of Suntech ceramic capillary is recommended, which has been proven to enhance the coupling interface between the capillary tip surface and the silver alloy wire, providing more efficient ultrasonic energy transfer.

Micromorphology of Ceramics capillary Powder

Micromorphology of ceramic capillary material

Material properties of ceramics capillary 

Surface texture characteristics of ceramics capillary

Morphology of SUNTECH Capillary Bonding First Welding and Second Welding

At 1000kb, point C pull > 6.0 g，service life is more than 2000Kb.

Concluding

The ceramic capillary provided by SUNTECH have independent research and development, production, sales and back-end technical services products, and provide customized services. The material properties are close to those of other manufacturers, and the dimensional processing accuracy meets the leading requirements of the industry, with very high cost performance.