AMB Alumina copper-clad plate

Compared with traditional DBC substrate, ceramic substrate prepared by AMB technology not only has higher thermal conductivity, better copper layer bonding, but also has the advantages of lower thermal resistance, higher reliability.  Alumina base plate is the most cost-effective AMB ceramic base plate with wide sources and the lowest cost, and the most mature process to prepare alumina AMB ceramic copper clad plate.  AMB alumina substrate is mostly used in the field where power density is not high and reliability is not strictly required. 

  Specification

Advantages of AMB Al₂O₃ ceramic substrate:  

1. Alumina ceramic substrate has high mechanical strength, good acid and alkali resistance, good thermal conductivity, and low cost.  

2. AMB alumina ceramic copper clad plate technology is relatively mature.  

3. For heat dissipation and power requirements are not too high application environment can replace related products. 

Solution 

We are able to prepare AMB Al₂O₃ ceramic substrate with excellent performance through the following process.    

1. The linear expansion coefficient of alumina ceramics is relatively small, which is greatly different from that of metal. Residual stress will occur in the joint area when ceramics and metal are welded.  When the residual stress is large, cracks will appear at the joint, and even fracture will be caused.  

2. Alumina ceramics have high melting point, high hardness and strength, and are not easy to deform. When diffusion connection is required, the surface of the connected body is very smooth and clean.  

3. Brazing temperature, pressure and surface roughness of alumina ceramics have great influence on brazing strength. 

Challenge

The reliability of AMB Al₂O₃ ceramic substrate depends on many key factors, brazing process and bending strength of ceramic have great influence on the reliability of AMB ceramic substrate, and the matching of graphic design and copper porcelain thickness also has great influence. 

1. The interface morphology of alumina ceramics is closely related to the strength of copper foil brazing. The surface roughness of ceramic substrate has a great influence on the bonding strength of solder and ceramics at the joint.  

2. The temperature effect of brazing process is very important. For the silver copper titanium brazing solder used by our company, when the temperature exceeds 850℃, there will be holes and cracks on the welding surface.  

3. Brazing pressure is also one of the key factors of brazing success or failure, too much pressure will have brazing solder overflow, serious will affect the quality of the product. 

Result

The ceramic materials of our ceramic metallized products are 99 alumina ceramic and 92 black alumina ceramic substrate, and the forming method is flow molding, which can become the metallized ceramic substrate.  The metallization method has AMB brazing ceramic copper covering.  Product size precision, small warpage, metal and ceramic bonding force, metal and ceramic joint is dense, better heat dissipation.  Can be used for LED heat dissipation substrate, ceramic packaging, electronic circuit board, etc.